HDI板

HDI板生产能力

叠层结构 过孔结构 打样 中批量 大批量 可用性
1+N+1 Blind vias Yes Yes Yes 4+ layers
2+N+2 Staggered blind/buried vias Yes Yes Yes 6+ layers
2+N+2 Stacked blind/buried vias Yes Yes Yes 6+ layers
3+N+3 Staggered blind/buried vias Yes Yes / 8+ layers
3+N+3 Stacked blind/buried vias Yes / / 8+ layers
类目 能力
Quality Grade Standard IPC 2
Layer Count 4 - 32 layers
Order Quantity 1pc - 10000+ pcs
Lead Time 2days - 5weeks
Material Standard / high Tg FR-4, Rogers & FR-4 composite
Board Size Min. 6mm x 6mm | Max. 457mm x 610mm
Board Thickness 0.4mm - 3.0mm
Copper Weight 0.5oz - 2.0oz
Min. Trace/Space 2.5mil/2.5mil
Solder Mask Color Green, White, Blue, Black, Red, Yellow
Legend Color White, Black, Yellow
Surface Finish HAL LF, HAL, ENIG, OSP, Immersion SIlver / Tin
Min. Annular Ring 4mil, 3mil (laser drill)
Laser Drill 6mil, 4mil
Impedance Tolerance ±10%
Stiffener PI, FR-4, steel
Other Features Rigid-flex combination, VIP, Buried passive(prototype only)