| Category | Item | Typical | Advanced |
|---|---|---|---|
| Basic | Layer Count | 2L - 28L | 2L - 32L |
| Basic | Base Material & Matching Prepreg | FR-4(SY S1141, KB6160, CEM-3 ST210) | FR-4(SY S1000H, ITEQIT158) |
| Basic | Base Material & Matching Prepreg | Rogers4003, Rogers4350, Arlon25N | Rogers Series, Arlon Series, Taconic Series |
| Basic | Finished Brd. Thk. | 0.20 mm - 5.00 mm | 0.20 mm - 6.00 mm |
| Basic | Finished Copper Wt. | 0.5 oz - 4.0 oz(external), 0.25 oz - 4.00 oz(internal) | 0.5 oz - 8.0 oz(external), 0.25 oz - 9.00 oz(internal) |
| Basic | Min. Brd. Size | 15.00 mm * 20.00 mm(In-board tooling holes) | 10.00 mm * 10.00 mm |
| Basic | Max. Brd. Size | 23" * 30"(2L), 22" * 28"(≥4L) | 23" * 30"(2L), 22.5" * 30"(≥4L) |
| Surface Finish | OSP | 0.2 um - 0.4 um | 0.2 um - 0.4 um |
| Surface Finish | H.A.L.(leaded & lead-free) | 1 um - 40 um | 1 um - 40 um |
| Surface Finish | ENIG | 3 um - 5 um(nickle), 1 uin - 4 uin(gold) | 3 um - 5 um(nickle), 1 uin - 4 uin(gold) |
| Surface Finish | ENEPIG | ≥ 5 um(nickle), 1 uin - 6 uin(palladium), 1 uin - 6 uin(gold) | ≥ 5 um(nickle), 1 uin - 6 uin(palladium), 1 uin - 6 uin(gold) |
| Surface Finish | Immerison Silver | 6 uin - 12 uin | 6 uin - 12 uin |
| Surface Finish | Immersion Tin | ≥ 1 um | ≥ 1 um |
| Surface Finish | Galvanic Hard Gold | 5 uin - 40 uin | 5 uin - 80 uin |
| Surface Finish | Gold Finger/Connector | 1 uin - 40 uin | 1 uin - 80 uin |
| Surface Finish | Blue Mask Thk. | 0.20 mm - 0.60 mm | 0.20 mm - 0.60 mm |
| Surface Finish | Carbon Ink Thk. | 10 um - 50 um | 10 um - 50 um |
| Drill/Hole | Aspect Ratio for Mechanical Drill | 16:1(drill dia. ≥ 0.30 mm) | 16:1(drill dia. ≥ 0.30 mm) |
| Drill/Hole | Min. Mechanical Drill | 0.20 mm | 0.10 mm |
| Drill/Hole | Max. Mechanical Drill | 6.30 mm | 6.30 mm |
| Drill/Hole | Mechanical Blind Drill | 0.20 mm - 0.50 mm | 0.20 mm - 0.70 mm |
| Drill/Hole | Min. Laser Drill | 0.10 mm(single PP1080 thk.) | 0.10 mm(single PP1080 thk.) |
| Drill/Hole | Max. Laser Drill | 0.15 mm(single PP3313 thk.) | 0.15 mm(single PP3313 thk.) |
| Drill/Hole | Min. Drill for Material PTFE/PTFE Composite | 0.30 mm | 0.30 mm |
| Drill/Hole | Min. Half Hole Drill | 0.50 mm | 0.50 mm |
| Drill/Hole | Min. Overlapped Drill | 0.45 mm | 0.45 mm |
| Drill/Hole | Min. Backdrill | 0.50 mm | 0.50 mm |
| Drill/Hole | Min. Dielectric Thk. for Backdrill | 0.20 mm | 0.20 mm |
| Drill/Hole | Max. Hole for Bluemask Plugging | 5.00 mm | 5.00 mm |
| Drill/Hole | Max. Hole for Soldermask Plugging | 0.65 mm | 0.65 mm |
| Drill/Hole | Hole for Epoxy Fill | 0.10 mm - 0.45 mm | 0.10 mm - 0.70 mm |
| Drill/Hole | Counter Bore/Sink Hole Angle | 130°(dia.≤3.175 mm), 165°(dia. 3.175 mm - 6.300 mm) | 82°, 90°, 100°, 135°(dia. 3.175 mm - 6.300 mm) |
| Drill/Hole | Min. Mechanical Drill for Different Brd. Thk. | 0.15 mm(brd. thk. ≤ 0.80 mm) | 0.10 mm(brd. thk. ≤ 0.80 mm) |
| Drill/Hole | Min. Mechanical Drill for Different Brd. Thk. | 0.15 mm(brd. thk. ≤ 1.40 mm) | 0.15 mm(brd. thk. ≤ 1.20 mm) |
| Drill/Hole | Min. Mechanical Drill for Different Brd. Thk. | 0.20 mm(brd. thk. ≤ 2.80 mm) | 0.20 mm(brd. thk. ≤ 2.80 mm) |
| Copper Feature | Min. Annular Ring for Mechanical Drill | 4 mil | 4 mil(partially 3.5 mil) |
| Copper Feature | Min. Annular Ring for Laser Drill | 4 mil | 4 mil(partially 3.5 mil) |
| Copper Feature | Min. BGA Pad Dia. | 10 mil(excluding H.A.L) | 8 mil(excluding H.A.L) |
| Copper Feature | Min. BGA Pad Dia. for Leaded H.A.L. | 10 mil | 10 mil |
| Copper Feature | Min. BGA Pad Dia. for Lead-free H.A.L. | 12 mil | 12 mil |
| Copper Feature | Min, Pad Size for H.A.L. | 7 mil * 16 mil | 7 mil * 16 mil |
| Clearance/Distance | Min. External Copper to Brd. Outline Clearance for Not Exposing Copper After Milling | 8 mil | 8 mil |
| Clearance/Distance | Min. Internal Copper to Brd. Outline Clearance for Not Exposing Copper After Milling | 8 mil | 8 mil |
| Clearance/Distance | Min. Drill to Drill(different nets) Clearance for CAF Proof | 9 mil | 12 mil(≥16 mil for mission critical application) |
| Clearance/Distance | Min. Bluemask to Pad Clearance | 14 mil | 14 mil |
| Clearance/Distance | Min. Drill(compensated) to Conductor Clearance for 1 Buildup | 5.5 mil(4L), 7 mil(6L - 8L), 8 mil(10L - 16L), 9 mil(18L - 28L), 12 mil(>28L) | 5.0 mil(4L), 6 mil(6L - 8L), 7 mil(10L - 16L),8 mil(18L - 28L), 10 mil(>28L) |
| Clearance/Distance | Min. Distance for V-score Jump | 15 mm(brd. thk. ≤ 1.60 mm) | 12 mm(brd. thk. ≤ 1.60 mm) |
| Solder Mask | Lacquer Color | Green(matt/glossy), Yellow, Black(matt/glossy), Blue, Red, White, Orange | Green(matt/glossy), Yellow, Black(matt/glossy), Blue, Red, White, Orange |
| Solder Mask | Min. Soldermask Web | 0.10 mm | 0.075 mm |
| Solder Mask | Min. Soldermask to Pad Clearance | 0.10 mm | 0.10 mm |
| Solder Mask | Min. Soldermask Track Cover | 0.10 mm | 0.10 mm |
| Solder Mask | Soldermask Thk. on Copper | 10 um - 18 um | 10 um - 18 um |
| Solder Mask | Soldermask Thk. at Shoulder | ≥ 5 um(one-time printing) | ≥ 5 um(one-time printing) |
| Solder Mask | Soldermask Thk. over Hole | ≥ 5 um | ≥ 5 um |
| Legend | Lacquer Color | White, Yellow, Black, Orange | White, Yellow, Black, Orange |
| Legend | Min. Stroke Width | 0.17 mm | 0.17 mm |
| Legend | Min. Height for Legibility | 1.00 mm | 1.00 mm |
| Legend | Min. Legend to Pad Clearance | 4 mil | 4 mil |
| Profile | Panelization | V-score, Tab-routing, Tab-routing & Perforation, Tab-routing & V-score, Tab-routing & V-score & Perforation | V-score, Tab-routing, Tab-routing & Perforation, Tab-routing & V-score, Tab-routing & V-score & Perforation |
| Profile | V-score Angle | 20°, 30°, 60° | 20°, 30°, 60° |
| Profile | Brd. Thk. for Double-side V-score | 0.80 mm - 3.20 mm | 0.80 mm - 3.20 mm |
| Profile | Brd. Thk. for Single-side V-score | 0.60 mm - 0.80 mm | 0.60 mm - 0.80 mm |
| Profile | Min. Inside Corner Radius | 0.40 mm | 0.30 mm |
| Finger/Edge Connector | Edge Beveling Angle | 30°, 45° | 30°, 45° |
| Finger/Edge Connector | Edge Chamfering Corner | 45° | 45° |
| Finger/Edge Connector | Min. Notch Width beside Edge Connector | 0.20 mm | 0.20 mm |
| Finger/Edge Connector | Edge Beveling Depth | 0.50 mm | 0.50 mm |
| Finger/Edge Connector | Min. Finger Top to Copper Distance | 3.00 mm | 2.00 mm |
| Finger/Edge Connector | Min. Finger Bot. to Brd. Outline | 7.00 mm | 6.00 mm |
| Finger/Edge Connector | Min. Finger to Finger Clearance | 6 mil | 5 mil |
| Others | Brd. Thk. for Epoxy Fill | 0.50 mm - 6.50 mm | 0.40 mm - 6.50 mm |
| Others | Min. Channel for Internal Split Plane | 8 mil | 8 mil |
| Others | Min. Trace Width/Space for Epoxy Fill | 4.0 mil / 4.0 mil | 3.5 mil / 3.5 mil |
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