| Category | Item | Typical | Advanced |
|---|---|---|---|
| Basic | Layer Count | 1L - 4L | 2L - 6L |
| Basic | Base Material & Matching Prepreg | Aluminum, Copper Base Material | Aluminum, Copper Base Material(ITEQ, CSEM) |
| Basic | Thermal Conductivity | 1.0 - 3.0 w/mk | 3.0 - 4.0 w/mk |
| Basic | Finished Brd. Thk. | 0.5 mm - 4.00 mm | 0.5 mm - 5.0 mm |
| Basic | Finished Copper Wt. | 0.5 oz - 4.0 oz(External), 0.25 oz - 3.00 oz(Internal) | 0.5 oz - 6.0 oz(external), 0.25 oz - 4.00 oz(Internal) |
| Basic | Min. Brd. Size | 15.00 mm * 20.00 mm | 10.00 mm * 10.00 mm |
| Basic | Max. Brd. Size | 210 * 1200 mm, 550*550 mm | 210*1500 mm, 550*680mm |
| Surface Finish | H.A.L.(leaded / lead-free) | 1 um - 40 um | 1 um - 40 um |
| Surface Finish | OSP | 0.2 um - 0.4 um | 0.2 um - 0.4 um |
| Surface Finish | ENIG | 3 um - 5 um(nickle), 1 uin - 4 uin(Gold) | 3 um - 5 um(nickle), 1 uin - 4 uin(Gold) |
| Surface Finish | Immersion Tin | ≥ 1 um | ≥ 1 um |
| Drill/Hole | Aspect Ratio for Mechanical Drill | 16:1(drill dia. ≥ 0.30 mm) | 16:1(drill dia. ≥ 0.30 mm) |
| Drill/Hole | Min. Mechanical Drill | 0.30 mm | 0.20 mm |
| Drill/Hole | Max. Mechanical Drill | 4.0 mm | 5.2 mm |
| Drill/Hole | Max. Hole for Bluemask Plugging | 5.00 mm | 5.00 mm |
| Drill/Hole | Max. Hole for Soldermask Plugging | 0.65 mm | 0.65 mm |
| Drill/Hole | Counter Bore/Sink Hole Angle | YES | YES |
| Clearance/Distance | Min. External Copper to Brd. Outline Clearance for Not Exposing Copper After Milling | 8 mil | 8 mil |
| Clearance/Distance | Min. Internal Copper to Brd. Outline Clearance for Not Exposing Copper After Milling | 8 mil | 8 mil |
| Clearance/Distance | Min. Drill to Drill(different nets) Clearance for CAF Proof | 9 mil | 12 mil(≥16 mil for mission critical application) |
| Clearance/Distance | Min. Bluemask to Pad Clearance | 14 mil | 14 mil |
| Clearance/Distance | Min. Drill(compensated) to Conductor, Clearance for 1 Buildup | 5.5 mil(4L), 7 mil(6L - 8L), 8 mil(10L - 16L), 9 mil(18L - 28L), 12 mil(>28L) | 5.0 mil(4L), 6 mil(6L - 8L), 7 mil(10L - 16L), 8 mil(18L - 28L), 10 mil(>28L) |
| Clearance/Distance | Min. Distance for V-score Jump | 15 mm(brd. thk. ≤ 1.60 mm) | 12 mm(brd. thk. ≤ 1.60 mm) |
| Solder Mask | Lacquer Color | Green(matt/glossy), Yellow, Black(matt/glossy), Blue, Red, White, Orange | Green(matt/glossy), Yellow, Black(matt/glossy), Blue, Red, White, Orange |
| Solder Mask | Min. Soldermask Web | 0.10 mm | 0.075 mm |
| Solder Mask | Min. Soldermask to Pad Clearance | 0.10 mm | 0.10 mm |
| Solder Mask | Min. Soldermask Track Cover | 0.10 mm | 0.10 mm |
| Solder Mask | Soldermask Thk. on Copper | 0.05 - 0.08 mm | 0.05 - 0.08 um |
| Solder Mask | Soldermask Thk. at Shoulder | ≥ 0.01(one-time printing) | ≥ 0.01(one-time printing) |
| Solder Mask | Soldermask Thk. Over Hole | ≥ 0.01 um | ≥ 0.01 |
| Legend | Lacquer Color | White, Yellow, Black, Orange | White, Yellow, Black, Orange |
| Legend | Min. Stroke Width | 0.17 mm | 0.17 mm |
| Legend | Min. Height for Legibility | 1.00 mm | 1.00 mm |
| Legend | Min. Legend to Pad Clearance | 0.15 mm | 0.10 mm |
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