Rigid Printed Circuit Board

CategoryItemTypicalAdvanced
BasicLayer Count2L - 28L2L - 32L
BasicBase Material & Matching PrepregFR-4(SY S1141, KB6160, CEM-3 ST210)FR-4(SY S1000H, ITEQIT158)
BasicBase Material & Matching PrepregRogers4003, Rogers4350, Arlon25NRogers Series, Arlon Series, Taconic Series
BasicFinished Brd. Thk.0.20 mm - 5.00 mm0.20 mm - 6.00 mm
BasicFinished Copper Wt.0.5 oz - 4.0 oz(external), 0.25 oz - 4.00 oz(internal)0.5 oz - 8.0 oz(external), 0.25 oz - 9.00 oz(internal)
BasicMin. Brd. Size15.00 mm * 20.00 mm(In-board tooling holes)10.00 mm * 10.00 mm
BasicMax. Brd. Size23" * 30"(2L), 22" * 28"(≥4L)23" * 30"(2L), 22.5" * 30"(≥4L)"
Surface FinishOSP0.2 um - 0.4 um0.2 um - 0.4 um
Surface FinishH.A.L.(leaded & lead-free)1 um - 40 um1 um - 40 um
Surface FinishENIG3 um - 5 um(nickle), 1 uin - 4 uin(gold)3 um - 5 um(nickle), 1 uin - 4 uin(gold)
Surface FinishENEPIG≥ 5 um(nickle), 1 uin - 6 uin(palladium), 1 uin - 6 uin(gold)≥ 5 um(nickle), 1 uin - 6 uin(palladium), 1 uin - 6 uin(gold)
Surface FinishImmerison Silver6 uin - 12 uin6 uin - 12 uin
Surface FinishImmersion Tin≥ 1 um≥ 1 um
Surface FinishGalvanic Hard Gold5 uin - 40 uin5 uin - 80 uin
Surface FinishGold Finger/Connector1 uin - 40 uin1 uin - 80 uin
Surface FinishBlue Mask Thk.0.20 mm - 0.60 mm0.20 mm - 0.60 mm
Surface FinishCarbon Ink Thk.10 um - 50 um10 um - 50 um
Drill/HoleAspect Ratio for Mechanical Drill16:1(drill dia. ≥ 0.30 mm)16:1(drill dia. ≥ 0.30 mm)
Drill/HoleMin. Mechanical Drill0.20 mm0.10 mm
Drill/HoleMax. Mechanical Drill6.30 mm6.30 mm
Drill/HoleMechanical Blind Drill0.20 mm - 0.50 mm0.20 mm - 0.70 mm
Drill/HoleMin. Laser Drill0.10 mm(single PP1080 thk.)0.10 mm(single PP1080 thk.)
Drill/HoleMax. Laser Drill0.15 mm(single PP3313 thk.)0.15 mm(single PP3313 thk.)
Drill/HoleMin. Drill for Material PTFE/PTFE Composite0.30 mm0.30 mm
Drill/HoleMin. Half Hole Drill0.50 mm0.50 mm
Drill/HoleMin. Overlapped Drill0.45 mm0.45 mm
Drill/HoleMin. Backdrill0.50 mm0.50 mm
Drill/HoleMin. Dielectric Thk. for Backdrill0.20 mm0.20 mm
Drill/HoleMax. Hole for Bluemask Plugging5.00 mm5.00 mm
Drill/HoleMax. Hole for Soldermask Plugging0.65 mm0.65 mm
Drill/HoleHole for Epoxy Fill0.10 mm - 0.45 mm0.10 mm - 0.70 mm
Drill/HoleCounter Bore/Sink Hole Angle130°(dia.≤3.175 mm), 165°(dia. 3.175 mm - 6.300 mm)82°, 90°, 100°, 135°(dia. 3.175 mm - 6.300 mm)
Drill/HoleMin. Mechanical Drill for Different Brd. Thk.0.15 mm(brd. thk. ≤ 0.80 mm)0.10 mm(brd. thk. ≤ 0.80 mm)
Drill/HoleMin. Mechanical Drill for Different Brd. Thk.0.15 mm(brd. thk. ≤ 1.40 mm)0.15 mm(brd. thk. ≤ 1.20 mm)
Drill/HoleMin. Mechanical Drill for Different Brd. Thk.0.20 mm(brd. thk. ≤ 2.80 mm)0.20 mm(brd. thk. ≤ 2.80 mm)
Copper FeatureMin. Annular Ring for Mechanical Drill4 mil4 mil(partially 3.5 mil)
Copper FeatureMin. Annular Ring for Laser Drill4 mil4 mil(partially 3.5 mil)
Copper FeatureMin. BGA Pad Dia.10 mil(excluding H.A.L)8 mil(excluding H.A.L)
Copper FeatureMin. BGA Pad Dia. for Leaded H.A.L.10 mil10 mil
Copper FeatureMin. BGA Pad Dia. for Lead-free H.A.L.12 mil12 mil
Copper FeatureMin, Pad Size for H.A.L.7 mil * 16 mil7 mil * 16 mil
Clearance/DistanceMin. External Copper to Brd. Outline Clearance for Not Exposing Copper After Milling8 mil8 mil
Clearance/DistanceMin. Internal Copper to Brd. Outline Clearance for Not Exposing Copper After Milling8 mil8 mil
Clearance/DistanceMin. Drill to Drill(different nets) Clearance for CAF Proof9 mil12 mil(≥16 mil for mission critical application)
Clearance/DistanceMin. Bluemask to Pad Clearance14 mil14 mil
Clearance/DistanceMin. Drill(compensated) to Conductor Clearance for 1 Buildup5.5 mil(4L), 7 mil(6L - 8L), 8 mil(10L - 16L), 9 mil(18L - 28L), 12 mil(>28L)5.0 mil(4L), 6 mil(6L - 8L), 7 mil(10L - 16L),8 mil(18L - 28L), 10 mil(>28L)
Clearance/DistanceMin. Distance for V-score Jump15 mm(brd. thk. ≤ 1.60 mm)12 mm(brd. thk. ≤ 1.60 mm)
Solder MaskLacquer ColorGreen(matt/glossy), Yellow, Black(matt/glossy), Blue, Red, White, OrangeGreen(matt/glossy), Yellow, Black(matt/glossy), Blue, Red, White, Orange
Solder MaskMin. Soldermask Web0.10 mm0.075 mm
Solder MaskMin. Soldermask to Pad Clearance0.10 mm0.10 mm
Solder MaskMin. Soldermask Track Cover0.10 mm0.10 mm
Solder MaskSoldermask Thk. on Copper10 um - 18 um10 um - 18 um
Solder MaskSoldermask Thk. at Shoulder≥ 5 um(one-time printing)≥ 5 um(one-time printing)
Solder MaskSoldermask Thk. over Hole≥ 5 um≥ 5 um
LegendLacquer ColorWhite, Yellow, Black, OrangeWhite, Yellow, Black, Orange
LegendMin. Stroke Width0.17 mm0.17 mm
LegendMin. Height for Legibility1.00 mm1.00 mm
LegendMin. Legend to Pad Clearance4 mil4 mil
ProfilePanelizationV-score, Tab-routing, Tab-routing & Perforation, Tab-routing & V-score, Tab-routing & V-score & PerforationV-score, Tab-routing, Tab-routing & Perforation, Tab-routing & V-score, Tab-routing & V-score & Perforation
ProfileV-score Angle20°, 30°, 60°20°, 30°, 60°
ProfileBrd. Thk. for Double-side V-score0.80 mm - 3.20 mm0.80 mm - 3.20 mm
ProfileBrd. Thk. for Single-side V-score0.60 mm - 0.80 mm0.60 mm - 0.80 mm
ProfileMin. Inside Corner Radius0.40 mm0.30 mm
Finger/Edge ConnectorEdge Beveling Angle30°, 45°30°, 45°
Finger/Edge ConnectorEdge Chamfering Corner45°45°
Finger/Edge ConnectorMin. Notch Width beside Edge Connector0.20 mm0.20 mm
Finger/Edge ConnectorEdge Beveling Depth0.50 mm0.50 mm
Finger/Edge ConnectorMin. Finger Top to Copper Distance3.00 mm2.00 mm
Finger/Edge ConnectorMin. Finger Bot. to Brd. Outline7.00 mm6.00 mm
Finger/Edge ConnectorMin. Finger to Finger Clearance6 mil5 mil
OthersBrd. Thk. for Epoxy Fill0.50 mm - 6.50 mm0.40 mm - 6.50 mm
OthersMin. Channel for Internal Split Plane8 mil8 mil
OthersMin. Trace Width/Space for Epoxy Fill4.0 mil / 4.0 mil3.5 mil / 3.5 mil