HDI PCB

HDI PCB Manufacturing Capability

Layer Stack	Via Structure	Prototype	Medium Run	Large Run	Availability
1+N+1	Blind vias	Yes	Yes	Yes	4+ layers
2+N+2	Staggered blind/buried vias	Yes	Yes	Yes	6+ layers
2+N+2	Stacked blind/buried vias	Yes	Yes	Yes	6+ layers
3+N+3	Staggered blind/buried vias	Yes	Yes	/	8+ layers
3+N+3	Stacked blind/buried vias	Yes	/	/	8+ layers

Item	Capacity
Quality Grade	Standard IPC 2
Layer Count	4 - 32 layers
Order Quantity	1pc - 10000+ pcs
Lead Time	2days - 5weeks
Material	Standard / high Tg FR-4, Rogers & FR-4 composite
Board Size	Min. 6mm x 6mm \| Max. 457mm x 610mm
Board Thickness	0.4mm - 3.0mm
Copper Weight	0.5oz - 2.0oz
Min. Trace/Space	2.5mil/2.5mil
Solder Mask Color	Green, White, Blue, Black, Red, Yellow
Legend Color	White, Black, Yellow
Surface Finish	HAL LF, HAL, ENIG, OSP, Immersion SIlver / Tin
Min. Annular Ring	4mil, 3mil (laser drill)
Laser Drill	6mil, 4mil
Impedance Tolerance	±10%
Stiffener	PI, FR-4, steel
Other Features	Rigid-flex combination, VIP, Buried passive(prototype only)